PI (Polyimide) reinforcement plate bonding processing
Consistent support from polyimide cutting to vacuum temporary bonding and complete curing for FPC.
●Features - Polyimide boasts extremely high heat resistance and excellent mechanical properties, electrical insulation, and chemical resistance, making it suitable for use in electronic components such as flexible printed circuits (FPC) in smartphones and camera modules. - With years of experience and know-how in reinforcing plates for FPCs in electronic components, we can provide a consistent service from die-cutting of polyimide to vacuum temporary bonding and complete curing after cure for supplied FPCs. - We can accommodate customer requests through consistent support across all phases, from material procurement and die-cutting to bonding with supplied components.
